LG Electronics unveiled its Hydronic Modular cooling system alongside 1-megawatt and 2.6-MW coolant distribution units at Data Center World Asia 2026 in Singapore on 29 September, The Korea Herald reported. LG says the prefabricated system can shorten AI data centre construction and allow operators to expand cooling capacity in stages.
Key points
- Hydronic Modular puts pumps, valves, emergency buffer tanks and piping in prefabricated containers that connect to chillers on site.
- LG says operators can add modules as they install more servers, spreading cooling investment across expansion stages.
- The company says its 600-kilowatt, 1-MW and 2.6-MW coolant distribution units have received Nvidia qualification.
- A separate One LG offering combines cooling equipment, battery systems and data centre services from three group companies.
Hydronic Modular shifts assembly to the factory
Hydronic Modular groups the pumps, valves, emergency buffer tanks and piping needed to move chilled water towards server rooms. The equipment is assembled inside containers built to International Organization for Standardization specifications, Chosunbiz reported. At the data centre, installers connect the completed module to a chiller with piping rather than weld and assemble those components individually on site.
LG says that arrangement reduces site work and construction time. Operators can add modules when they expand a facility, matching cooling purchases to successive installations of AI servers rather than installing the full system at the outset. The operator bears the cooling investment. The proposed savings concern the timing of that spending and the amount of assembly required at the site.
The container system handles chilled-water delivery rather than every stage of cooling. LG also displayed an air-cooled, oil-free inverter turbo chiller. Its compressor uses magnetic bearings to reduce friction, while a refrigerant free-cooling function uses outside air to remove heat without running the compressor when temperatures are low, according to the company. A fan wall unit supplies cool air to server rooms and removes heat.
LG shows 1-MW and 2.6-MW liquid-cooling units
The coolant distribution units address heat closer to the processors. They circulate coolant through cold plates attached directly to GPUs and CPUs, rather than relying solely on air moving through a server room. LG displayed 1-MW and 2.6-MW models at the Singapore event. The company says those units and a 600-kilowatt model have received Nvidia qualification, The Korea Herald reported.
AI Affairs previously reported on LG’s qualification of the 2.6-MW unit. The Singapore display placed that equipment beside the new container system and chiller. LG describes a broader approach as “chip to chiller”, covering the cold plates at processors, the units that circulate coolant and the chillers that remove heat.
LG is also developing immersion cooling, which places heat-generating equipment in electrically nonconductive fluid. That work sits alongside the coolant-distribution products on display, which send liquid through plates in contact with chips. The company presented both approaches as parts of its data centre cooling range.
One LG brings batteries and construction together
The One LG offering extends beyond LG Electronics’ heating, ventilation and air conditioning equipment. It combines that business with LG Energy Solution’s batteries and LG CNS’ data centre design, construction and operating capabilities. The group is positioning those businesses together for operators building or expanding AI facilities.
AI Affairs has also reported on LG Electronics’ expanded Microsoft partnership, which includes data centres. At the Singapore exhibition, LG CNS showed a prefabricated modular data centre incorporating servers, power and cooling equipment, while LG Energy Solution displayed batteries for backup and power systems, Chosunbiz reported.
