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Wednesday 21 October 2026

Markets · Brief

Nvidia targets 2.5x substrate capacity in six-partner expansion

The plans include a $1.1 billion advance for new US testing facilities and additional manufacturing capacity in Japan, South Korea and Taiwan.

Nvidia headquarters entrance beneath a broad white canopy on a sunny day
Photo: Coolcaesar, CC BY-SA 4.0, via Wikimedia Commons (cropped)

Nvidia said in its 21 October announcement at GTC Berlin that agreements with IBIDEN, Samsung Electro-Mechanics and Unimicron are intended to increase substrate capacity for its products 2.5x over three years. The suppliers are among six partners in Nvidia’s plans to expand manufacturing for AI hardware.

Nvidia is providing IBIDEN a multibillion-dollar capacity reservation advance under an agreement signed earlier in 2026. At IBIDEN’s Ono Plant in Japan, the expansion targets 3x current capacity, and output from the added capacity is expected to start ramping up in the first quarter of 2028. Samsung Electro-Mechanics is joining Nvidia’s substrate supply chain with capacity from existing South Korean operations, while the collaboration supports upgrades and new factories in Sejong and Busan. AI Affairs previously reported a separate W6.78 trillion substrate expansion backed by customers at Samsung Electro-Mechanics. Unimicron’s Taiwan expansion is expected to add capacity from the second quarter of 2027.

Nvidia is advancing $1.1 billion to King Yuan Electronics to reserve capacity at new US testing facilities, which target high-volume production in April 2027. Amkor targets an increase of more than 300% in South Korean interposer wafer capacity by the end of 2028. Siliconware Precision Industries aims to increase Taiwanese optical-engine capacity 15x by mid-2027, then double it again by the end of 2028.

Sources

Topics: Chips, Manufacturing