Markets TSMC’s 2nm capacity could reach 120,000 wafers a month by year-end By Reem Al-Dosari · 30 Sep 2026
Corporate PATEO signs Arm memorandum to explore physical AI for vehicles By Reem Al-Dosari · 30 Sep 2026
Corporate Microsoft leaves Copilot+ PC badge off two new Surface models By Reem Al-Dosari · 29 Sep 2026
Technology China Telecom opens weights for Xing4.0-29B-A4B, trained on Ascend chips By Wes Tanaka · 29 Sep 2026
Technology Inspur launches 128-chip MetaBrain SD200 Ultra for Kimi K3 inference By Wes Tanaka · 29 Sep 2026
Markets SK Hynix’s Solidigm weighs US IPO at valuation of up to $150 billion By Reem Al-Dosari · 28 Sep 2026
Corporate GSME and Teradyne agree multi-year partnership for semiconductor test centre By Reem Al-Dosari · 28 Sep 2026
Technology ASM launches flowable carbon process to fill and level chip features By Wes Tanaka · 28 Sep 2026
Technology Google plans first orbital AI chip test on 1 October SpaceX launch By Wes Tanaka · 27 Sep 2026
Markets Civo plans 40 UK edge data centres with a 1 GW AI capacity target By Reem Al-Dosari · 27 Sep 2026
